Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Get Free Report) announced a quarterly dividend on Wednesday, November 13th,RTT News reports. Stockholders of record on Tuesday, January 7th will be paid a dividend of 0.205 per share by the semiconductor company on Thursday, December 19th. This represents a $0.82 annualized dividend and a dividend yield of 1.80%. This is a positive change from Kulicke and Soffa Industries’s previous quarterly dividend of $0.20.
Kulicke and Soffa Industries has raised its dividend payment by an average of 15.5% annually over the last three years. Kulicke and Soffa Industries has a payout ratio of 43.5% indicating that its dividend is sufficiently covered by earnings.
Kulicke and Soffa Industries Stock Performance
Shares of KLIC stock opened at $45.61 on Friday. The stock’s 50-day moving average price is $44.00 and its 200 day moving average price is $45.36. Kulicke and Soffa Industries has a 52-week low of $38.20 and a 52-week high of $56.71.
Wall Street Analyst Weigh In
KLIC has been the topic of a number of analyst reports. Craig Hallum lowered their price objective on shares of Kulicke and Soffa Industries from $55.00 to $50.00 and set a “buy” rating on the stock in a research report on Thursday, August 8th. StockNews.com cut shares of Kulicke and Soffa Industries from a “hold” rating to a “sell” rating in a report on Tuesday. Finally, TD Cowen reduced their price objective on shares of Kulicke and Soffa Industries from $52.00 to $45.00 and set a “hold” rating for the company in a research report on Thursday, August 8th. One investment analyst has rated the stock with a sell rating, three have given a hold rating and one has assigned a buy rating to the company. Based on data from MarketBeat.com, the stock has an average rating of “Hold” and a consensus target price of $47.33.
Get Our Latest Stock Analysis on Kulicke and Soffa Industries
Kulicke and Soffa Industries Company Profile
Kulicke and Soffa Industries, Inc designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment.
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